The SpeedStar 20-nozzle Collect&Place head was developed especially for the premium placement machines of the SIPLACE X-Series and is considered the current industry benchmark in terms of performance and precision.
On the SIPLACE X4i platform, the high-performance SpeedStar is capable of placing more than 30,000 cph!
The standard SIPLACE SpeedStar comes with a vacuum sensor, a force sensor and a compensation of PCB warpage – features that most other manufacturers offer only as separate options or not at all.
The individual component pickup, the integrated turning station per segment and the digital vision system that takes a high-resolution picture of each component to ensure the process reliability you need for efficient high-volume production. No wonder that the placement performance stays at its high level even for 01005 components that measure merely 0.3 x 0.15 mm.
The 20-nozzle Collect&Place head is your head of choice for the high-precision high volume placement of components ranging from 01005 to 6 x 6 mm that are up to 4 mm high. Despite its speed and precision, the head and its components are designed for longevity and low maintenance – you benefit not only from breathtaking performance, but also from high availability and low maintenance costs.
