The SIPLACE X4i gets part of its name and its record-breaking performance from a totally new placement concept called i-Placement.
Previously, SIPLACE machines took turns placing components in each placement area, i.e. while one head places components, the other head was busy picking up a new supply. With the i-Placement system of the SIPLACE X4i, both heads operate in parallel and totally independently of each other in their respective placement areas. In dual-conveyor mode, each head is fully responsible for populating only one of the two PCBs.
The first benefit of i-Placement is a significant improvement in performance. Since their travel times are much shorter, the 20-nozzle heads can pick up and place the components much faster than before.